Case Study | CIS Inspection of Semiconductor Lead Frames
Compact LineX CIS imaging supports high-precision, multi-format lead-frame defect inspection and process traceability.
Application
Semiconductor lead-frame production calls for inline inspection of hole defects, burrs, residue, and other process anomalies. Compact equipment and frequent product changes complicate camera integration.
Approach
The integrated LineX CIS imaging system delivers high-resolution, full-width inspection without stitching images from multiple cameras. Defect type and position data support process traceability.