INSNEX at Automation Taipei 2026

INSNEX at Automation Taipei

At Automation Taipei, August 19–22, 2026, INSNEX demonstrated machine vision products for PCB, semiconductor, electronics, printing, and battery production.

Two demonstrations

For metal components, the imaging setup brought out fine surface detail so visitors could see how scratches, dents, stains, and press marks can be distinguished. Continuous machine-vision inspection offers a repeatable alternative to visual spot checks.

Flexible printed circuits present a different problem: reflective, deformable material makes small patches of residual film difficult to see. The FPC demonstration used tailored imaging to expose incomplete film removal before it affected the next production step.

Live inspection examples

Metal-part inspection revealed scratches, dents, stains, and pressure marks. An FPC film-removal demonstration showed how targeted imaging can identify residual or incompletely removed film on reflective flexible circuits.

Visitors met the team at booths 4F L408, 1F K316, and 1F I104 to discuss practical inspection requirements.